Packaging & Testing
Chizhou Hisemi Electronic Technology Co., LTD. Packaging business mainly LGA, QFN, DFN, SOP, SOT, TO, LQFP series, a total of more than 100 varieties. Since its establishment, the company has always focused on the integrated circuit packaging and testing field, adhering to the core of technological innovation, has master multi-chip module (MCM) package, THREE-DIMENSIONAL (3D) stack core package, miniaturized flat pin less (QFN/DFN) package, high-density micro-spacing integrated circuit package and other core technologies. It has a strong competitive strength in the field of IC packaging and testing.
IC Package Process：
Copper wire, palladium copper wire process ability
Machine：KS RAPID、KS Iconn LA、KS connx elite、ASM Aero、ASM Eagle Xtreme、ihawk Xtreme/GOCU、ASM Eagle60/ihawk
|
Wire diameter
|
Min welding area size
|
Min welding area spacing
|
Min aluminum layer thickness
|
Balls Min aluminum layer thickness
|
Welding line length
|
|---|---|---|---|---|---|
|
18um/0.7mil
|
50×50um
|
60um
|
0.8um
|
0.8um
|
0.1~8mm
|
|
20um/0.8mil
|
55×55um
|
60um
|
0.8um
|
0.8um
|
0.1~8mm
|
|
25um/1.0mil
|
70×70um
|
75um
|
1.2um
|
1.2um
|
0.1~8mm
|
|
30um/1.2mil
|
85×85um
|
90um
|
2.0um
|
2.0um
|
0.1~8mm
|
|
38um/1.5mil
|
104×104um
|
115um
|
3.0um
|
3.0um
|
0.1~8mm
|
|
42um/1.7mil
|
115×115um
|
125um
|
4.0um
|
4.0um
|
0.1~8mm
|
Gold wire, alloy wire process ability
Machine：KS RAPID、KS Iconn LA、KS connx elite、ASM Aero、ASM Eagle Xtreme、ihawk Xtreme/GOCU、ASM Eagle60/ihawk
|
Wire diameter
|
Min welding area size
|
Min welding area spacing
|
Min aluminum layer thickness
|
Balls Min aluminum layer thickness
|
Welding line length
|
|---|---|---|---|---|---|
|
18um/0.7mil
|
48×48um
|
60um
|
0.6um
|
0.6um
|
0.1~8mm
|
|
20um/0.8mil
|
50×50um
|
60um
|
0.8um
|
0.8um
|
0.1~8mm
|
|
25um/1.0mil
|
65×65um
|
75um
|
0.8um
|
0.8um
|
0.1~8mm
|
|
30um/1.2mil
|
78×78um
|
90um
|
1.0um
|
1.0um
|
0.1~8mm
|
|
38um/1.5mil
|
104×104um
|
115um
|
2.0um
|
2.0um
|
0.1~8mm
|
|
42um/1.7mil
|
115×115um
|
130um
|
2.0um
|
2.0um
|
0.1~8mm
|
